#### Bond Work Index FormulaEquation

WEBJul 15, 2013 · In the standard AC closed circuit ball mill grindability test the work index is found from. where Pi is the opening in microns of the sieve mesh tested, and Gbp is the net grams of mesh undersize produced per revolution of the 12″ x 12″ test ball mill. The closed circuit 80% passing size P averages P1/log 20 for all sizes larger than 150 mesh.